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High volume flip chip on flexible circuitry is routine at Automated Assembly.  The SMT Flex Roll-To-Roll process developed at AAC. Specifically for flip chip assembly.  Manufactured onto one thousand foot rolls of circuitry.  The flip chip die is bonded using solder or Wire Bonding.  Inter-connects to a variety of substrates including Polyimide, PEN, Polyester and recently Paper. 

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The use of solder or Wire Bonding for bonding flip chips is recommended.  Especially for assemblies requiring superior strength. Conductive adhesive may also be used as an inter-connect when assembling flip chips.  The electrical and mechanical properties of conductive adhesive are not as robust as solder, however conductive adhesive bonded flip chips may be suitable for ambient environment applications.

Our flip chip assembly provides unlimited possibilities for creating quality products that match your design and cost parameters.  Some applications may include:  Radio Frequency Identification (RFID), Smart Cards, Hearing Aids, Toll-way Tracking, Cell Phones, Credit Cards, Video Gambling, Automotive,  Satellite TV, LAN, or WIFI Technology.  In addition to it’s application, flip chip on flex technology can be used in a wide variety of markets requiring RFID or micro-electronics including

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High volume flip chip on flexible circuitry is routine at Automated Assembly.  The SMT Flex Roll-To-Roll process developed at AAC. Specifically for flip chip assembly.  Manufactured onto one thousand foot rolls of circuitry.  The flip chip die is bonded using solder or Wire Bonding.  Inter-connects to a variety of substrates including Polyimide, PEN, Polyester and recently Paper. 

Automated-Assembly-Wafer-Handling-768x1075

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In Fact, High Volume Roll-To-Roll Wire Bonding on Flex is standard process at Automated Assembly Corp.  As the first in the USA, our Patented Technology allows Flex Circuit assemblies to be manufacture Roll-To-Roll.  Wafer handling for up to 25 different wafers allows no shortage of design possibilities for direct die attach.